Technical Support-Chengdu Guangchuanglian Technology Co., Ltd.

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Since its establishment, Eugenlight Technologies has been focusing on optoelectronic integration technology, committed to the development of multi-channel/multiple chip integration technologies, and evolution to high-density heterogeneous integration technology at the board and substrate levels.

With the completion and operation of the multi-channel integrated product line, Eugenlight successively started to launch industry-leading products, such as the 800G COBO optical engine (2019), I-temp 25G MWDM TOSA (2020), integrated Combo PON ONU (2021), 100G ZR+ OSA (2022), silicon based external cavity laser for FMCW Lidar (2023), 400G coherent C+L band ITLA (2024), and RGB multi-chip integrated MCL laser source module (2024).

After years of accumulation in technology development, production, and marketing, together with the “Segment Champion” strategy, Eugenlight has been recognized as a leading high-speed optoelectronic integrated device supplier in the global industry, serving world-class customers.

TO - based Platform /同轴产品平台

● Narrow linewidth laser

● Innovative integration design beyond traditional TO - based Optics

● Proprietary “Eugen - Passive Process” to ensure reliable mass production

● Pioneering in compact, integrated, and multi - port OSAs of challenging specs

● Featured products:

    ■ Quad - OSA for XG/XGS Combo PON ONU/OLT

    ■ 10G/25G EML TDM/CWDM/DWDM TOSA

    ■ 25G TOSA / ROSA / BOSA (10km, 30km,80km)

    ■ 50G/100GLR1/ER1 TOSA/ROSA/BOSA

Chip on Board Platform/COB平台

● Hybrid optoelectronics integration: Chip on Board (COB), Optics on Board, Co - packaging on board or submount level

● High performance in signal and power integrity

● low cost by eliminating surplus intermediary package

● Featured products:

■ 400G DR4 optical engine

■ 800G 2x FR4 optical engine

Box Platform /盒型产品平台

● Single channel and Planar multi - channel integration

● Cooled TEC in transmitter, built - in TIA in receiver

● Hermetical sealing to ensure high reliability

● Non - hermetical solutions also available to support cost reduction

● Featured products:

        ■ Single channel 10G/25G D/L/CWDM DML/EML TOSA

        ■ Single lambda 50G/100G TOSA

        ■ 100G LR4/ER4/ZR TOSA/ROSA/BOSA

        ■ Non - hermetical 100G ROSA

        ■ 400G LR4/ER4 TOSA/ROSA

        ■ Tunable laser/ITLA

CPO(Co-package Optics)

CPO optoelectronic common packaging (Co-package Optics) technology is to use a hybrid integrated packaging between bare chips (such as laser chips, silicon optical chips, etc.) at the board or substrate level, effectively coping with the density size, power consumption, and electromagnetic radiation at a rate of more than 800G Severe challenges in terms of interference performance and cost. In the foreseeable 3-5 years, the CPO technology of optoelectronic co-packaging will gradually change the technical scheme of optoelectronic interconnection and the ecology of the industry, bringing revolutionary impact to the optoelectronic device industry.